发明名称 High Throughput TEM Preparation Processes and Hardware for Backside Thinning of Cross-Sectional View Lamella
摘要 A method for TEM sample preparation and analysis that can be used in a FIB-SEM system without re-welds, unloads, user handling of the lamella, or a motorized flip stage. The method allows a dual beam FIB-SEM system with a typical tilt stage to be used to extract a sample to from a substrate, mount the sample onto a TEM sample holder capable of tilting, thin the sample using FIB milling, and rotate the sample so that the sample face is perpendicular to an electron column for STEM imaging.
申请公布号 US2013248354(A1) 申请公布日期 2013.09.26
申请号 US201213691270 申请日期 2012.11.30
申请人 FEI COMPANY 发明人 KEADY PAUL;PETERSON BRENNAN;DAS GUUS;HENRY CRAIG;DWORKIN LARRY;BLACKWOOD JEFF;STONE STACEY;SCHMIDT MICHAEL
分类号 H01J37/305;H01J37/30 主分类号 H01J37/305
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