| 摘要 |
PROBLEM TO BE SOLVED: To provide an improved wire bonding system including a wire loop molding tool.SOLUTION: There is disclosed a wire bonding system. The system includes a bonding head 350, a bonding tool 302 held by the bonding head, a wire 326 supplied for bonding by the bonding tool, and a wire molding tool 301 held by the bonding head. The wire molding tool can freely move independently of the bonding head and bonding tool. |
