| 摘要 |
PROBLEM TO BE SOLVED: To enable an interval between lines of an electrode pad of a semiconductor chip to be smaller.SOLUTION: A TAB tape 10 comprises: an insulation substrate 1 having an opening 3 for bonding; a lead 2 provided on one main face of the insulation substrate with a part crossing the opening as an inner lead 4 facing inside of the opening. In the TAB tape, the inner lead is cut above the opening and a cut end of the inner lead, or a tip end 4a, is bonded on an electrode pad 31 of a semiconductor chip 30 arranged through an insulation elastic body 20 on the one main face of the insulation substrate. A curved shape part 5 as a highly extended characteristic part is provided between a base end 4b of the inner lead supported by a circumference of the opening and the tip end 4a formed by cutting the inner lead, and also a hook part 6 is provided as a tool for extending the curved shape part on bonding, at any position between the tip end and the curved shape part 5. |
