ELASTIC WAVE FILTER ELEMENT AND METHOD FOR MANUFACTURING SAME

摘要

Provided is a method for manufacturing an elastic wave filter element having an improved heat dissipation performance. This elastic wave filter element (1) is provided with a transmission-side elastic wave filter chip (11a) and a reception-side elastic wave filter chip (11b). The transmission-side elastic wave filter chip (11a) has a support substrate (12), a piezoelectric layer (14), and an IDT electrode (15). The support substrate (12) is made from an insulating material. The piezoelectric layer (14) is directly or indirectly supported by the support substrate (12). The IDT electrode (15) is provided so as to be in contact with the piezoelectric layer (14). The reception-side elastic wave filter chip (11b) has a piezoelectric substrate (18) and an IDT electrode (19) provided on the piezoelectric substrate (18). The thermal conductivity of the support substrate (12) is higher than the thermal conductivity of either of the piezoelectric layer (14) and the piezoelectric substrate (18).