LIGHT EMITTING DIODE CHIP AND METHOD OF FABRICATING THE SAME

摘要

PURPOSE: A light emitting diode chip and a manufacturing method thereof are provided to easily set a lamination sequence by including a top structure for an alternative lamination. CONSTITUTION: A plurality of light emitting cells (30) are separately arranged on the upper surface of a substrate. The light emitting cells include a first conductive semiconductor layer, a second conductive semiconductor layer, and an active layer. A top structure (37) is located on the upper surfaces of the light emitting cells. A wire (51) electrically connects the first conductive semiconductor to the second conductive semiconductor. The top structure is located on the wire and the light emitting cells.