SLICING METHOD OF PRISM-SHAPED INGOT

摘要

PROBLEM TO BE SOLVED: To provide a method of producing a wafer by cutting an ingot while reducing the loss rate thereof.SOLUTION: One side face 20a of an ingot 20 having four side faces subjected to grinding is polished, and a support plate 22 is bonded to the side face 20a thus polished by an adhesive 21 to produce a laminate w. The support plate 22 of the laminate is directed upward and one side face of the ingot is directed downward, and the ingot is sliced by means of a wire 32 while lowering the laminate thus producing a wafer of 80-120 μm thick.