COOLING STRUCTURE FOR ELECTRONIC SUBSTRATE, AND ELECTRONIC DEVICE USING SAME

摘要

Use of cooling structures for electronic substrates in heat-emitting elements which emit a large amount of heat causes an increase in the size of the electronic device. Hence, this cooling structure for an electronic substrate has: a vaporizer equipped with a vaporization vessel for storing coolant; a condenser for dissipating heat by condensing and liquefying the gaseous coolant which was vaporized by the vaporizer; and a tube for connecting the vaporizer and the condenser. Therein: one side-surface of the vaporization vessel of the vaporizer is provided with a heat-receiving region which is thermally connected to a heat-emitting body positioned on the electronic substrate; a region including the heat-receiving region is provided with a plurality of flow-channel plates extending in a direction parallel to the electronic substrate; and the gas-liquid interface of the coolant is positioned at or above the bottom end and below the top end in the vertical direction of the heat-receiving region, when the direction in which the flow-channel plates extend is positioned substantially in parallel to the vertical direction.