| 摘要 |
PURPOSE: A manufacturing method of a copper clad laminate with an aluminum superficial layer and a printed circuit board using the copper clad laminate are provided to coat an aluminum foil with copper and to induce the high luminance of an LED(Light Emitting Diode) using the glossy surface of aluminum foil, thereby manufacturing a high-performance printed circuit board for an LED. CONSTITUTION: A manufacturing method of a copper clad laminate comprises the steps of: preparing metal foil(1) which has a matted surface on one surface and has a glossy surface on the other surface; cleaning the matted surface of the metal foil with a degreasing agent; forming an uneven surface by soft-etching the cleaned glossy surface; forming a zincate layer and a copper sputtering layer by zincating and sputtering the rough surface; forming a copper plating layer on the zincating layer and the copper sputtering layer through an electroless plating method or an electrolytic plating method; forming a rough surface on the copper plating layer; and forming a resin layer by compressing the insulation resin on the rough surface at a high temperature and pressure. |
