LIGHT EMITTING DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

摘要

PURPOSE: A light emitting device package and a method for manufacturing the same are provided to effectively release heat by directly connecting the light emitting device package to a line pattern instead of mounting the light emitting device package on a circuit substrate. CONSTITUTION: A light emitting laminate includes a first main surface and a main surface. A terminal part (20) is formed under the second main surface. A mold (30) is formed under the second main surface. The mold exposes a part of the terminal part. A wavelength converting part (40) is formed on the first main surface.