| 摘要 |
PURPOSE: A bonding apparatus and a bonding method are provided to obtain a uniform bonding thickness by preventing adhesive from being pressed out due to flow. CONSTITUTION: A supply part supplies adhesive to one surface of at least one work (S1). The supply part includes a dispenser for dropping the adhesive (R) stored in a tank on the work through a pipe. A bonding part (2) includes a bonding device for bonding the work (S2). The bonding device includes a vacuum chamber, a pressing device, and an irradiation part (23). The irradiation part irradiates an electromagnetic wave to the adhesive that partially or totally covers at least one surface of a pair of the bonded works. |
