| 摘要 |
PURPOSE: A solid state imaging device and a camera system are provided to implement miniaturization by forming a lamination structure consisting of two chips. CONSTITUTION: A first chip (110) is formed in a first conductivity type substrate. A pixel part is formed in the first conductivity type substrate. Pixels are arranged in the pixel part. A second chip (120) is formed in a second conductive substrate. The first chip and the second chip form a laminating structure. [Reference numerals] (110) First chip (Analog Chip); (120) Second chip (Logic Chip); (BPD) Bonding Pad opening |
