Partially aromatic moulding masses and their applications

摘要

Polyamide molding compound comprises: (A) a polyamide mixture (27-84.99 wt.%) comprising (A1) at least one semiaromatic, semicrystalline polyamide having a melting point of 255-330[deg] C, and (A2) at least one caprolactam-containing polyamide that is different from the at least one semiaromatic, semicrystalline polyamide (A1) and that has a caprolactam content of at least 50 wt.%; (B1) at least one filler and reinforcing agent (15-65 wt.%); (C) at least one thermal stabilizer (0.01-3 wt.%); and (D) at least one additive (0-5 wt.%). Polyamide molding compound comprises: (A) a polyamide mixture (27-84.99 wt.%) comprising (A1) at least one semiaromatic, semicrystalline polyamide having a melting point of 255-330[deg] C, and (A2) at least one caprolactam-containing polyamide that is different from the at least one semiaromatic, semicrystalline polyamide (A1) and that has a caprolactam content of at least 50 wt.%, where the sum of the caprolactam contained in polyamide (A1) and polyamide (A2) is 22-30 wt.%, with respect to the polyamide mixture; (B1) at least one filler and reinforcing agent (15-65 wt.%); (C) at least one thermal stabilizer (0.01-3 wt.%); and (D) at least one additive (0-5 wt.%), where no metal salts and/or metal oxides of a transition metal of the groups VB, VIB, VIIB or VIIIB of the periodic table are present in the polyamide molding compound.