发明名称 CUTTING CONTROL METHOD OF A LASER PROCESSING MACHINE
摘要 PURPOSE: A method for controlling the process of a laser process apparatus is provided to significantly shorten the time substantially required for the material process, and to implement the value satisfaction of a customer being a toll processing business. CONSTITUTION: A method for controlling the process of a laser process apparatus comprises the following steps. In a case where a process head (20) is located in the outside of material area, the process head enters the material area under the lead-in condition as the cutting condition. After the process head enters the material area, a cutting condition is changed to a normal cutting condition to process the material. The lead-in condition is controlled so that the process assist gas pressure is changed to a low pressure while a laser beam is emitted from a nozzle. The normal cutting condition is controlled so that the pressure is changed to be higher and increased by the fixed value compared to the process assist gas pressure in the lead in condition. [Reference numerals] (AA) Edge unit; (BB) Material
申请公布号 KR20130103871(A) 申请公布日期 2013.09.25
申请号 KR20120024842 申请日期 2012.03.12
申请人 HAN KWANG CO., LTD. 发明人 KAY, MYUNG JAE;YANG, JI WON;LEE, CHUNG GI
分类号 B23K26/00;B23K26/14 主分类号 B23K26/00
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