发明名称
摘要 <P>PROBLEM TO BE SOLVED: To provide a positive-type resist composition which causes no pattern fall not only in ordinary exposure (dry exposure) but also in liquid immersion exposure, cancels a trade-off relation, is broad in exposure latitude and reduces line edge roughness, and to provide a pattern-forming method using the positive-type resist composition. <P>SOLUTION: The positive-type resist composition contains: a specific compound which generates a sulfonic acid, which has ester structure and a fluorine atom, by the radiation of active beams or radiation; and a resin which is 150&deg;C or below in glass transition temperature and increases its solubility in an alkali developer due to the action of an acid. The pattern-forming method is also provided using the positive-type resist composition. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP5297714(B2) 申请公布日期 2013.09.25
申请号 JP20080201284 申请日期 2008.08.04
申请人 发明人
分类号 G03F7/039;G03F7/004 主分类号 G03F7/039
代理机构 代理人
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