发明名称 |
Wiring board device, luminaire and manufacturing method of the wiring board device |
摘要 |
<p>According to one embodiment, a wiring board device includes a ceramic board including a first surface and a second surface. A first electrode layer is formed on the first surface of the ceramic board, and a second electrode layer is formed on the second surface of the ceramic board. The first electrode layer and the second electrode layer are not electrically connected to each other. A first copper plated layer as a wiring pattern is formed on the first electrode layer, and a second copper plated layer is formed on the second electrode layer. The first copper plated layer and the second copper plated layer are not electrically connected to each other. A heat spreader is thermally connected to the second copper plated layer.</p> |
申请公布号 |
EP2642836(A2) |
申请公布日期 |
2013.09.25 |
申请号 |
EP20120173733 |
申请日期 |
2012.06.27 |
申请人 |
TOSHIBA LIGHTING & TECHNOLOGY CORPORATION |
发明人 |
BETSUDA, NOBUHIKO;TANAKA, HIROTAKA;HONMA, TAKUYA;WATANABE, MIHO;NISHIMURA, KIYOSHI |
分类号 |
H05K1/02;H05K1/03 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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