HEAT-RESISTANT PRESSURE-SENSITIVE ADHESIVE TAPE FOR PRODUCTION OF SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE USING THE TAPE

摘要

PURPOSE: A heat-resistant pressure-sensitive adhesive tape is provided to prevent the dislocation of chips by sufficient pressure at sealing a resin and to be easily separated without forming residues after use. CONSTITUTION: A heat-resistant pressure-sensitive adhesive tape for manufacturing a semiconductor device is attached to pre-fix the chip at sealing a substrateless semiconductor chip by a resin. The heat resistant adhesive tape includes a substrate and adhesive layers formed on both sides of the substrate. At least one adhesive layer attaching the semiconductor chip by the resin includes a silicon adhesive. The other adhesive layer includes a heat-expandable adhesive which contains heat-expandable micropores.