<p>An arrangement of an electronic component in a plastic housing, including a cover and a lower part, and to a method for fixing the electronic component in the housing. The cover is connected to the lower part and exerts a pre-defined force (F) on the electronic component. The cover is designed such that the influence of the height tolerance (dh) of the electronic component on the force (F) can be compensated to the effect that, once the cover has been mounted, the force (F) applied to the lower part is in a pre-defined force range (B).</p>
申请公布号
EP2149286(B1)
申请公布日期
2013.09.25
申请号
EP20080715509
申请日期
2008.02.23
申请人
CONTI TEMIC MICROELECTRONIC GMBH
发明人
TRENNER, UWE;WIECZOREK, MATTHIAS;HENNIGER, JUERGEN;KARRER, HELMUT;WENK, ALEXANDER;FALKNER, ROLAND;BUHL, JOACHIM