| 摘要 |
<p>PURPOSE: An improved backside illumination image sensor architecture and a method for manufacturing the same are provided to improve quantum efficiency by providing a packaging configuration. CONSTITUTION: Touch pads (18) are electrically connected to optical detectors (14). Color filters (34) are respectively formed on one among the optical detectors. The optical detectors produce electrical signals in response to light incident. The incident light passes through the color lenses.</p> |
