| 摘要 |
<p>PURPOSE: A substrate cooling apparatus and a substrate treating facility are provided to quickly cool the temperature of a substrate using a cooling gas. CONSTITUTION: A first housing(110) accommodates a processed substrate(W1). The first housing includes a bottom wall(110a), an upper wall(110b), and a sidewall(110c). A first cooling plate(120) is a plate-like shape. The radius of the first cooling plate is larger than that of the substrate. A cooling channel(121) is formed in the first cooling plate. A first cooling gas supply part(130) supplies cooling gas to the inner part of the first housing. The first cooling gas supply part includes a gas supply line(131), a gas injection pipe(132), and a diffuser(135).</p> |
