| 摘要 |
PURPOSE: A substrate plating apparatus and a system for plating substrates with the same are provided to improve plating efficiency by directly performing a plating process after pre-wetting. CONSTITUTION: A system for plating substrates comprises a device frame (10), a plurality of plating devices (100), and a wetting device (200). The device frame comprises a plurality of divided spaces. The plurality of plating devices is placed in the divided spaced, and performs a plating process. The pre-wetting device is placed in the divided space and pre-wets the substrates before the plating process. The device frame comprises a plurality of unit frames, and walls are detachably connected to joint parts between the unit frames. |
