| 摘要 |
<p>Provided is a soldering flux in which the volatilized amount in reflowing is reduced to enable soldering with a small environmental load while suppressing the stickiness of the flux residue to ensure a high reliability, as well as a solder paste composition and a soldering method using the same. The soldering flux comprises a base resin, an activating agent, and a solvent, wherein the solvent comprises an organic acid anhydride being liquid form at 20°C or higher and a polyhydric alcohol being liquid form at 20°C or higher, and when the acid value and the content of the organic acid anhydride is AV (mgKOH/g) and W A (g), respectively, and the hydroxyl value and the content of the polyhydric alcohol is OHV (mgKOH/g) and W OH (g) ,respectively, then AV × W A : OHV × W OH = 1 : 0.4 to 0.6.</p> |
