发明名称 INDUCTOR FOR POST PASSIVATION INTERCONNECT
摘要 PURPOSE: An inductor for post passivation interconnect is provided to improve shielding performance by arranging a dummy pad near a part of a coil. CONSTITUTION: A PPI (Post Passivation Interconnect) layer (12) is arranged on a substrate (16). The PPI layer forms a coil and a dummy pad. The dummy pad is arranged near a part of the coil. The dummy pad shields a corresponding coil from electromagnetic interference. A UBM (Under Bump Metallization) layer (14) is arranged on the substrate. [Reference numerals] (16) Silicon; (18) Upper metal layer
申请公布号 KR20130105228(A) 申请公布日期 2013.09.25
申请号 KR20120065170 申请日期 2012.06.18
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. 发明人 TSAI HAO YI;CHEN HSIEN WEI;KUO HUNG YI;CHEN JIE;CHEN YING JU;YU TSUNG YUAN
分类号 H01L27/02 主分类号 H01L27/02
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