发明名称 |
INDUCTOR FOR POST PASSIVATION INTERCONNECT |
摘要 |
PURPOSE: An inductor for post passivation interconnect is provided to improve shielding performance by arranging a dummy pad near a part of a coil. CONSTITUTION: A PPI (Post Passivation Interconnect) layer (12) is arranged on a substrate (16). The PPI layer forms a coil and a dummy pad. The dummy pad is arranged near a part of the coil. The dummy pad shields a corresponding coil from electromagnetic interference. A UBM (Under Bump Metallization) layer (14) is arranged on the substrate. [Reference numerals] (16) Silicon; (18) Upper metal layer |
申请公布号 |
KR20130105228(A) |
申请公布日期 |
2013.09.25 |
申请号 |
KR20120065170 |
申请日期 |
2012.06.18 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
发明人 |
TSAI HAO YI;CHEN HSIEN WEI;KUO HUNG YI;CHEN JIE;CHEN YING JU;YU TSUNG YUAN |
分类号 |
H01L27/02 |
主分类号 |
H01L27/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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