| 摘要 |
<p>PURPOSE: A method for bonding a light emitting device for a light emitting device module is provided to improve heat radiation efficiency and to easily bond the light emitting device to a mounting substrate by the oxidation of metal materials. CONSTITUTION: A first semiconductor layer (112), an active layer (113), and a second semiconductor layer (114) are laminated on a light emitting device. The light emitting device is formed on a substrate (111). A liquid (130) is coated on a mounting substrate (120) which is oxidizable. The surface of the light emitting device is bonded to the mounting substrate. An oxidizable metal layer coated with the liquid is arranged between the light emitting device and the mounting substrate. The mounting substrate is made of one or more metal materials among aluminum, silicon, titanium, chrome, nickel, zinc, and tin.</p> |
