| 摘要 |
PURPOSE: A printed circuit board and a manufacturing method thereof improve the quality of a thin plate by overlapping two flexible copper clad laminates (FCCL). CONSTITUTION: A core insulating layer (110) is flexibly formed. A first circuit pattern is formed on one part among the upper part or the lower part of the core insulating layer. A second circuit pattern (120) is formed on the other part among the upper part or the lower part of the core insulating layer. The first circuit pattern includes a seed layer (122) and a plating layer. The second circuit pattern is formed in a single layer. |
