| 摘要 |
PROBLEM TO BE SOLVED: To provide a means that can, while securing enough heat resistance, even after curing, control at minimum the decrease of the adhesive strength with a noble metal (especially copper or the alloy) or the like composing a lead frame, a wiring or the like in a curable resin composition that can be used for a semiconductor seal material or the like. SOLUTION: The curable resin composition including a curable resin, further includes: (A) a nitrogen-containing cyclic compound that has two or more reactive functional groups, and has two or more ring nitrogen atoms; and (B) a silane compound which is shown by the average composition formula: X<SB POS="POST">a</SB>Y<SB POS="POST">b</SB>Z<SB POS="POST">c</SB>SiO<SB POS="POST">d</SB>and has a structure unit in which at least one of organic groups X bonds with a silicon atom forming a siloxane bond, in the formula, X each independently denotes a group having an organic skeleton including an imide bond; Y is each independently chosen from the group consisting of a hydrogen atom, a hydroxy group, a halogen atom, and OR group, wherein R is each independently chosen from the group consisting of a substituted or unsubstituted alkyl group, a substituted or unsubstituted acyl group, a substituted or unsubstituted aryl group, a substituted or unsubstituted alkenyl group, and a substituted or unsubstituted alkenyl group; Z each independently denotes an organic group not including an imide bond; and a, b, c and d each satisfy 0<a≤3, 0≤b<3, 0≤c<3, 0<d<2, and a+b+c+2d=4. COPYRIGHT: (C)2013,JPO&INPIT |
