发明名称
摘要 PROBLEM TO BE SOLVED: To maintain an adhesion state and an electrical connection state over a long period of time by preventing peeling and the loss of the electrical connection state which occur when an adhesive layer between a head chip and a wiring board comes into contact with ink. SOLUTION: In an inkjet head in which the harmonica type head chip 1 and the wiring board 3, in which wiring electrodes 32 corresponding to each of drive electrodes 13 are formed, are adhered by an adhesive and the drive electrodes 13 and the wiring electrodes 32 are electrically connected, an adhesion area formed by the adhesive between the head chip 1 and the wiring board 3 is divided into at least two areas of an area A1 including a contact surface with the ink supplied to the head chip 1 and an area A2 not including the contact surface with the ink across a cut-off area A3 where the adhesive does not exist, and the electrical connection parts between the drive electrodes 13 and the wiring electrodes 32 are not located in the cut-off area A3 and the area A1 including the contact surface with the ink. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP5298685(B2) 申请公布日期 2013.09.25
申请号 JP20080193659 申请日期 2008.07.28
申请人 发明人
分类号 B41J2/055;B41J2/045 主分类号 B41J2/055
代理机构 代理人
主权项
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