<p>PURPOSE: An image sensor is provided to prevent the increase of a chip size by arranging a metal wire on the rear side of a substrate. CONSTITUTION: A substrate (200) includes a sensor array area, a circuit area, and a pad area. A multilayered wire structure (240) is formed on the front side of the substrate in the sensor array area and the circuit area. The multilayered wire structure includes an insulation layer (242) between metal layers and a plurality of wire layers (244). A multilayered wire structure (250) is formed on the front side of the substrate in the pad area. At least one well (222) is formed on the substrate in the circuit area. At least one metal wire (232) is extended from the pad area to the circuit area on a second surface which is opposite to a first surface of the substrate.</p>
