| 摘要 |
PURPOSE: A system-in-package module with an electromagnetic wave shielding function is provided to be widely used for a small communication module by minimizing the size of the system-in-package module. CONSTITUTION: A ground plate (15) is formed on the upper side of a printed circuit board (10) to shield an electromagnetic wave. A conductive bottom circuit pattern (12) and a conductive land (13) are formed on the lower side of the printed circuit board. A plurality of active devices (23) and a plurality of passive devices (21) are mounted on the lower side of the printed circuit board. A molding resin (30) is formed on the lower side of the printed circuit board to surround the active devices and the passive devices. A solder ball (40) is electrically connected to the conductive bottom circuit pattern or the conductive land. An electromagnetic wave shielding unit (50) is electrically connected from the ground plate to the solder ball via the conductive land. |
