发明名称 |
Electrical interconnect forming method |
摘要 |
An electrical interconnect forming method. The electrical interconnect includes a first substrate comprising a first electrically conductive pad, a second substrate comprising a second electrically conductive pad, and an interconnect structure electrically and mechanically connecting the first electrically conductive pad to the second electrically conductive pad. The interconnect structure comprises a non-solder metallic core structure, a first solder structure, and a second solder structure. The first solder structure electrically and mechanically connects a first portion of the non-solder metallic core structure to the first electrically conductive pad. The second solder structure electrically and mechanically connects a second portion of the non-solder metallic core structure to the second electrically conductive pad.
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申请公布号 |
US8541299(B2) |
申请公布日期 |
2013.09.24 |
申请号 |
US20100787527 |
申请日期 |
2010.05.26 |
申请人 |
BUCHWALTER STEPHEN LESLIE;FURMAN BRUCE K.;GRUBER PETER A.;NAH JAE-WOONG;SHIH DA-YUAN;ULTRATECH, INC. |
发明人 |
BUCHWALTER STEPHEN LESLIE;FURMAN BRUCE K.;GRUBER PETER A.;NAH JAE-WOONG;SHIH DA-YUAN |
分类号 |
H01L21/44;H01L21/48 |
主分类号 |
H01L21/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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