| 发明名称 |
Packaging materials with enhanced thermal-insulating performance |
| 摘要 |
A packaging material including a paper-based substrate having a first surface and a second surface and a thermal-insulating composition on the first surface of the substrate, wherein the thermal-insulating composition includes, based on the total weight of the composition, filler in an amount of 20% to 70% by weight, organic binder in an amount of 15% to 70% by weight, and plasticizer in an amount of 0.5% to 10% by weight.
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| 申请公布号 |
US8541074(B2) |
申请公布日期 |
2013.09.24 |
| 申请号 |
US201113080064 |
申请日期 |
2011.04.05 |
| 申请人 |
BABINSKY VLADISLAV;ARENANDER SVEN SAMUEL;NEWMAN DOBRIDGE CELESTE;BABCOCK BRUCE W.;HAWES DAVID H.;MEADWESTVACO CORPORATION |
发明人 |
BABINSKY VLADISLAV;ARENANDER SVEN SAMUEL;NEWMAN DOBRIDGE CELESTE;BABCOCK BRUCE W.;HAWES DAVID H. |
| 分类号 |
B29D22/00;B29D23/00;B32B1/08;B32B27/10 |
主分类号 |
B29D22/00 |
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