发明名称 |
Electronic device package and method for fabricating the same |
摘要 |
The invention provides an electronic device package and a method for fabricating the same. The electronic device package includes a carrier wafer. An electronic device chip with a plurality of conductive pads thereon is disposed over the carrier wafer. An isolation laminating layer includes a lower first isolation layer, which covers the carrier wafer and the electronic device chip, and an upper second isolation layer. The isolation laminating layer has a plurality of openings to expose the conductive pads. A plurality of redistribution patterns is conformably formed on the isolation laminating layer and in the openings. The redistribution patterns are electrically connected to the conductive pads, respectively. A plurality of conductive bumps is respectively formed on the redistribution patterns, electrically connected to the conductive pads.
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申请公布号 |
US8541877(B2) |
申请公布日期 |
2013.09.24 |
申请号 |
US20100849089 |
申请日期 |
2010.08.03 |
申请人 |
TSAI CHIA-LUN;NI CHING-YU;HUANG TIEN-HAO;CHENG CHIA-MING;CHIEN WEN-CHENG;LIN NAN-CHUN;CHEN WEI-MING;CHANG SHU-MING;LOU BAI-YAO |
发明人 |
TSAI CHIA-LUN;NI CHING-YU;HUANG TIEN-HAO;CHENG CHIA-MING;CHIEN WEN-CHENG;LIN NAN-CHUN;CHEN WEI-MING;CHANG SHU-MING;LOU BAI-YAO |
分类号 |
H01L23/48 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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