| 发明名称 |
Method of minimizing beam bending of MEMS device by reducing the interfacial bonding strength between sacrificial layer and MEMS structure |
| 摘要 |
The beam bending of a MEMS device is minimized by reducing interfacial strength between a sacrificial layer and a MEMS structure.
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| 申请公布号 |
US8541854(B2) |
申请公布日期 |
2013.09.24 |
| 申请号 |
US201213349596 |
申请日期 |
2012.01.13 |
| 申请人 |
COTTE JOHN M.;HOIVIK NILS D.;JAHNES CHRISTOPHER;LU MINHUA;ZHANG HONGQING;INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
COTTE JOHN M.;HOIVIK NILS D.;JAHNES CHRISTOPHER;LU MINHUA;ZHANG HONGQING |
| 分类号 |
H01L21/00 |
主分类号 |
H01L21/00 |
| 代理机构 |
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代理人 |
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