发明名称 |
Semiconductor light-emitting device |
摘要 |
A semiconductor light-emitting device includes a lead frame, a semiconductor light-emitting element mounted on the top surface of the bonding region, and a case covering part of the lead frame. The bottom surface of the bonding region is exposed to the outside of the case. The lead frame includes a thin extension extending from the bonding region and having a top surface which is flush with the top surface of the bonding region. The thin extension has a bottom surface which is offset from the bottom surface of the bonding region toward the top surface of the bonding region.
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申请公布号 |
US8541808(B2) |
申请公布日期 |
2013.09.24 |
申请号 |
US201213414294 |
申请日期 |
2012.03.07 |
申请人 |
KOBAYAKAWA MASAHIKO;ROHM CO., LTD. |
发明人 |
KOBAYAKAWA MASAHIKO |
分类号 |
H01L33/00;H01L33/56;H01L33/60;H01L33/62 |
主分类号 |
H01L33/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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