| 摘要 |
PURPOSE: A manufacturing method of printing circuit board(PCB) is provided to protect a part-mounting unit during a process progressed by laminating a protective layer on the part-mounting unit which is exposed to air. CONSTITUTION: A substrate board equipped with a part-mounting unit is prepared (S110). The first prepreg layer and the second prepreg layer are laminated on upper side and lower side of substrate board, respectively (S120). A protective layer including a copper foil layer is laminated on upper side of the first prepreg layer (S130). A through-hole is formed so that an internal layer circuit pattern and an outer layer circuit pattern are conducted (S140). An outer layer circuit pattern is formed by partly etching the copper-plating layer formed on a surface of protective layer and surface of the second prepreg layer (S150). One part of protective layer corresponding to the part-mounting unit is removed using polyimide etchant (S160). The outer layer circuit pattern protection layer is formed on the outer layer circuit pattern (S170). [Reference numerals] (AA) Start; (BB) End; (S110) Inner layer patterns are formed on both upper and lower side, and a substrate board with a part-mounting unit is prepared; (S120) First prepreg layer with a window is laminated on the upper part of the substrate board, and the second prepreg layer is laminated on the lower part eh of substrate board; (S130) Protective layer including a copper foil layer is laminated on upper side of the first prepreg layer as flexible material; (S140) Through-hole is formed so that an internal layer circuit pattern and an outer layer circuit pattern to be formed are conducted; (S150) Outer layer circuit pattern is formed by partly etching the surface of the protective layer and the surface of the second prepreg layer to from outer circuit patterns, after forming copper-plating layer by copper-plating the surface of the copper foil layer of the protective layer, the surface of the second prepreg layer and the through-hole; (S160) Part of protective layer corresponding to the part-mounting unit is removed by using polyimide etchant; (S170) Outer layer circuit pattern protection layer is formed on the outer layer circuit as PSR |
