| 摘要 |
PURPOSE: An interface for inspecting a wafer and a wafer inspecting apparatus are provided to inspect the electrical properties of a semiconductor device by accurately controlling the location of a probe which is formed on a probe card and the location of an electrode of the semiconductor device which is formed on a wafer. CONSTITUTION: A probe card includes a plurality of probes which correspond to electrodes of a plurality of semiconductor devices. A frame (40) supports the probe card in contact with a surface which is opposite to the facing surface of the wafer of the probe card. The frame includes a frame body (41), a contact area (42) with the probe card, and a plurality of through holes (43) which are formed on the contact area. A plurality of through holes (46) for insulation are formed around the contact area to reduce a heat loss. A heating member (44) heats the probe card in contact with the frame. |
