| 摘要 |
PURPOSE: An ingot slicing method is provided to improve a utilization ratio of an ingot, and to improve a price competitiveness of a cut wafer. CONSTITUTION: An ingot slicing method comprises the following steps: a processing object inside the processing object is separated to a direction crossed with a thickness direction by moving a laser beam and by concentrating a laser beam (L) inside the processing object by using a condensing lens (210); a first separation material is formed by separating the processing object along a first separation side; a second separation side for separating a first separation material inside the first separation material along a direction crossed with a thickness direction is formed; and multiple second separation materials are formed by separating the first separation material along the second separation section. [Reference numerals] (100) Beam generator; (210) Condensing lens; (220) Zoom lens unit; (230) Optoisolator |
