| 摘要 |
PURPOSE: A chemical mechanical polishing apparatus is provided to prevent the damage of a wafer by stopping a wafer polishing process when a scratch is generated. CONSTITUTION: A pad supporting plate is installed on a base supporting unit. A head body part is installed on a polishing head supporting unit. A wafer replacement part (51) loads and unloads a wafer. An image pickup camera (53) and a lighting part (54) are installed on the base support unit. A polishing control part controls a total polishing process. |
