EPOXY RESIN COMPOSITION AND PRE-PREG, SUPPORT-PROVIDED RESIN FILM, METALLIC FOIL CLAD LAMINATE PLATE AND MULTILAYER PRINTED CIRCUIT BOARD UTILIZING SAID COMPOSITION

摘要

Provided is a prepreg prepared by impregnating a base material with a resin composition, wherein the resin composition contains aluminum hydroxide having an average particle diameter of 2.5 to 4.5 µm and a glass filler having an average particle diameter of 1.0 to 3.0 µm, a specific gravity of 2.3 to 2.6 g/cm 3 and a SiO 2 content of 50 to 65 % by mass; and a sum of blending amounts of aluminum hydroxide and the glass filler is 30 to 50 % by mass based on a whole amount of solid matters in the resin composition. According to the above prepreg, capable of being obtained is a metal clad laminated plate in which in spite of using an inorganic filler such as silica and the like and aluminum hydroxide in combination, the inorganic filler is evenly dispersed and which is excellent in a processability and has a low thermal expansion coefficient.