SEMICONDUCTOR PACKAGE AND THE METHOD

摘要

PURPOSE: A semiconductor package and a method thereof are provided to easily hold a heat radiation plate by forming a molding part on the step part of both edges of the heat radiation plate. CONSTITUTION: A circuit board is bonded to a semiconductor chip. A bonding pad and a circuit pattern are electrically connected by a conductive bump (230). An underfill layer is filled between the active surface of the semiconductor chip and the upper surface of the circuit board. A heat radiation plate (280) made of a metal material is formed on the upper surface of the semiconductor chip. A molding part (290) encapsulates a region except the upper surface of the heat radiation plate.