| 摘要 |
<p>PURPOSE: A liquid processing apparatus is provided to remove an area which is not processed on a wafer. CONSTITUTION: A substrate maintaining unit (21) horizontally maintains a substrate. The substrate maintaining unit includes a maintaining base, a first combination member (31), and a second combination member (32). A nozzle (35) supplies a processing liquid to the upper surface of the substrate which is maintained by the substrate maintaining unit. A lifting member vertically moves by interlocking with a lift base. A rotating cup (45) rotates with a chuck base by a connection unit. A lifting container member includes a first contacted part (51) and a second contacted part (52).</p> |
