摘要 |
PURPOSE: A camera module is provided to prevent a conductive material from overflowing to the outside, by filling the conductive material in a closed soldering space. CONSTITUTION: A grounding portion (11a) is protruded in the lower part of the side part of a shield can. A guide portion (21) is formed in the outer part of a circuit board (20). The grounding portion is inserted into the guide portion. A ground pad is comprised in the lower part of the circuit board. A conductive connection portion (30) is comprised in the lower part of the circuit board, in order to cover the ground pad. The conductive connection portion forms a closed soldering space (21a) on the guide portion. |