发明名称 CAMERA MODULE
摘要 PURPOSE: A camera module is provided to prevent a conductive material from overflowing to the outside, by filling the conductive material in a closed soldering space. CONSTITUTION: A grounding portion (11a) is protruded in the lower part of the side part of a shield can. A guide portion (21) is formed in the outer part of a circuit board (20). The grounding portion is inserted into the guide portion. A ground pad is comprised in the lower part of the circuit board. A conductive connection portion (30) is comprised in the lower part of the circuit board, in order to cover the ground pad. The conductive connection portion forms a closed soldering space (21a) on the guide portion.
申请公布号 KR101310565(B1) 申请公布日期 2013.09.23
申请号 KR20110136610 申请日期 2011.12.16
申请人 发明人
分类号 H04N5/225 主分类号 H04N5/225
代理机构 代理人
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