| 摘要 |
PURPOSE: A laser drilling apparatus and a laser drilling method are provided to use a first laser oscillator to irradiate an area which is planned to be bored with a heat beam in advance, and to use a second oscillator to irradiate the area which is planned to be bored with a boring beam, thereby performing drilling work. CONSTITUTION: A laser drilling apparatus includes a first laser oscillator(110), a second laser oscillator(120), and a pair of a first scanner and a second scanner(151,152). The first laser oscillator projects a heat beam(115) to heat up an area which is planned to be bored on a substrate(W). The laser oscillator projects a boring beam(125) to form through holes on the area of the substrate which is planned to be bored, and heated up by the heating beam. The pair of the first and second scanners irradiates the area which is planned to be bored with the heating beam which is projected by the first laser oscillator, and with the boring beam which is projected by the second laser oscillator. The heat beam is irradiated on the area which is planned to be bored in the direction where the heat beam and the bored beam move, before the processing beam is irradiated. [Reference numerals] (AA) Heating area; (BB) Boring area |
