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发明名称
双向切割装置
摘要
一种双向切割装置,包括一基台、一工作平台、一座体、及一刀头机构,工作平台用以放置一加工物,工作平台沿着一纵向方向而相对于基台移动,座体设置于基台,座体沿着一横向方向而相对于基台移动,刀头机构设置于座体,刀头机构包括一纵向切割构件及一横向切割构件,纵向切割构件及横向切割构件分别地沿着一高度方向而相对于座体移动,且纵向切割构件之切割端与横向切割构件之切割端为依序而不同时切割加工物,而达到省时、省工、节能、稳定、以及定位精确之效果,以增加制造产量。
申请公布号
TWM462171
申请公布日期
2013.09.21
申请号
TW102202506
申请日期
2013.02.05
申请人
田宇科技股份有限公司 桃园县八德市大兴路639之22号
发明人
林振东
分类号
B26B11/00
主分类号
B26B11/00
代理机构
代理人
林志青 台北市信义区松隆路102号18楼之1
主权项
地址
桃园县八德市大兴路639之22号
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