发明名称 |
Inductor for Post Passivation Interconnect |
摘要 |
An inductor device and method of forming the inductor device are provided. In some embodiments the inductor device includes a post passivation interconnect (PPI) layer disposed and an under bump metallization (UBM) layer, each disposed over a substrate. The PPI layer forms a coil and dummy pads. The dummy pads are disposed around a substantial portion of the coil to shield the coil from electromagnetic interference. A first portion of the UBM layer is electrically coupled to the coil and configured to interface with an electrical coupling member. |
申请公布号 |
US2013241683(A1) |
申请公布日期 |
2013.09.19 |
申请号 |
US201213419272 |
申请日期 |
2012.03.13 |
申请人 |
TSAI HAO-YI;CHEN HSIEN-WEI;KUO HUNG-YI;CHEN JIE;CHEN YING-JU;YU TSUNG-YUAN;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
TSAI HAO-YI;CHEN HSIEN-WEI;KUO HUNG-YI;CHEN JIE;CHEN YING-JU;YU TSUNG-YUAN |
分类号 |
H01F5/00;H01F41/02 |
主分类号 |
H01F5/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|