| 摘要 |
The invention relates to a microstructure component for conducting a fluid and to a method for the production thereof, in which a metal sheet (110) is guided through a gap between a pair of profiled rollers (100) and is thereby microstructured, wherein a wave profile (221) is created in the direction of the width, a microstructured plate (212, 216) is cut to length from the metal sheet (110), a solder (220) is applied to an unstructured plate (210, 214, 218), the microstructured plate (212, 216) and the unstructured plate (210, 214, 218) are put together to form a stack (200) and the stack (200) is connected by means of vacuum soldering. The microstructure component has microstructured plates (212, 216) and unstructured plates (210, 214, 218) stacked alternately one on top of the other, wherein the microstructured plates (212, 216) have a wave profile (221) that respectively has channel-shaped depressions (226) in the region of the crests, wherein between the microstructured plates and the unstructured plates there are soldered connections, which fill the channel-shaped depressions (226) and wherein there are formed between the plates fluid lines (230, 232), which are respectively bounded in the circumferential direction by a first surface of the microstructured plate (212, 216) and a second surface of the unstructured plate (210, 214, 218). |
