| 摘要 |
<p>Provided are a sealant paste and a sealing method whereby it is possible to shorten the sealing/forming cycle even when an aqueous medium is used. The sealant paste is for molding and sealing a device, and contains a copolymer polyamide resin and an aqueous medium. The copolymer polyamide resin may be crystalline, and the melting point or softening point of the copolymer polyamide resin may be 75-160° C. The copolymer polyamide resin may be a multi-component copolymer, e.g., a binary copolymer or a ternary copolymer. In addition, the copolymer polyamide resin may contain a unit derived from a long-chain component (at least one component selected from among C9-17 lactam and amino C9-17 alkane carboxylic acid) that has a C8-16 alkylene group. The sealant paste may additionally contain a thickening agent (for example, a (meth)acrylic acid polymer).</p> |
