| 摘要 |
<p>Provided is a plastic chassis which, through resinification, can be made lighter, thinner and more complex in shape, which, even when made thinner and lighter, has durability under high-temperature conditions and rigidity equivalent to that of magnesium metal chasses, and which can ensure product safety by suppressing decreased dimensional precision and warpage due to being thinner and lighter. Also provided is an electrical product component formed by adhering a component substrate configured from a thermoplastic resin to the aforementioned plastic chassis. This invention relates to a plated plastic chassis having a plastic chassis body formed from a filler reinforced plastic with a 4,000-22,000MPa flexural modulus according to ISO 178:2001, and a 5-50mum thick plating layer formed on at least a portion of the surface of the plastic chassis body.</p> |
