发明名称 ION MILLING DEVICE AND ION MILLING PROCESSING METHOD
摘要 The sample 3 is tilted/oscillated with respect to the optical axis (Z-axis) of the ion beam 2 to repeat tilt and tilt/restoration of a processing target surface 3a of the sample 3 between a surface state in which the processing target surface 3a of the sample 3 faces a tilt axis direction (Y-axis direction) and a tilted surface state in which a portion of the processing target surface 3a on the sample stage side protrudes in the tilt axis direction (Y-axis direction) than does a portion of the processing target surface 3 on the mask side, so that the processing target surface 3a is irradiated with the ion beam 2 at a low angle, and projections/recesses 63 derived from a void 61 or a dissimilar material 62 are suppressed. Accordingly, it is possible to suppress generation of projections/recesses derived from a void or dissimilar material in fabrication of a cross section sample, and thus fabricate a sample cross section suitable for observation/analysis.
申请公布号 US2013240353(A1) 申请公布日期 2013.09.19
申请号 US201113988506 申请日期 2011.11.21
申请人 WATANABE SHUNYA;KONOMI MAMI;TAKASU HISAYUKI;KAMINO ATSUSHI;HITACHI HIGH-TECHNOLOGIES CORPORATION 发明人 WATANABE SHUNYA;KONOMI MAMI;TAKASU HISAYUKI;KAMINO ATSUSHI
分类号 H01J37/305 主分类号 H01J37/305
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