| 摘要 |
A semiconductor module includes at least one intermediate plate which has heat conductivity, power semiconductor elements which are provided for respective main surfaces of the intermediate plate, heat sinks which are arranged so that the power semiconductor elements are held between the heat sinks and the intermediate plate, and a mold part which seals the intermediate plate, the power semiconductor elements, and the heat sinks with mold resin. Surfaces of the heat sinks opposite to the side of the power semiconductor elements are exposed from the mold part. The intermediate plate has an intermediate radiator which projects in the direction parallel to the main surface from the mold part.
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