| 摘要 |
The present disclosure relates to a semiconductor light emitting diode, and more specifically, to a semiconductor light emitting diode comprising: a first fluorescent body, which includes a semiconductor chip and a structure that enables the amount of light emitted upward from the semiconductor chip to exceed that emitted from the sides of the semiconductor chip, and which is placed on the upper surface of the semiconductor chip; and an encapsulant containing a second fluorescent body for encapsulating the semiconductor chip and the first fluorescent body, wherein the relatively small amount of light emitted from the sides of the semiconductor chip is emitted by passing through the second fluorescent body, and wherein the relatively large amount of light emitted upward from the semiconductor chip is emitted by passing through the first fluorescent body and the second fluorescent body. |
